US 12,280,429 B2
Systems and methods for defect detection and correction in additive manufacturing processes
Jingfu Liu, Prior Lake, MN (US); Behrooz Jalalahmadi, Long Island City, NY (US); Ziye Liu, West Lafayette, IN (US); Andrew Vechart, Minnetrista, MN (US); and Xiawa Wu, Erie, PA (US)
Assigned to Sentient Science Corporation, Buffalo, NY (US)
Filed by Sentient Science Corporation, Buffalo, NY (US)
Filed on Aug. 15, 2023, as Appl. No. 18/450,018.
Application 18/450,018 is a continuation of application No. 17/009,945, filed on Sep. 2, 2020, granted, now 11,724,315.
Prior Publication US 2024/0293870 A1, Sep. 5, 2024
Int. Cl. B22F 10/85 (2021.01); B22F 10/28 (2021.01); B23K 26/00 (2014.01); B23K 26/342 (2014.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); G01N 21/88 (2006.01); G06T 7/00 (2017.01)
CPC B22F 10/85 (2021.01) [B22F 10/28 (2021.01); B23K 26/0093 (2013.01); B23K 26/342 (2015.10); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); G01N 21/8851 (2013.01); G06T 7/001 (2013.01); G06T 2207/10048 (2013.01); G06T 2207/30136 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A system of correcting defects in an additive manufacturing process comprising:
an additive manufacturing device operable to form a first product and a second product by adding sequential layers of material on top of one another, wherein the additive manufacturing device is calibrated based on a comparison of a detected defect in the first product and a detected defect in the second product; and
a defect analysis subsystem communicated with the additive manufacturing device, wherein as each sequential layer of material is added, the defect analysis subsystem is operable to:
monitor the sequential layer to detect whether the sequential layer has any defects;
for a detected defect, determine whether defect correction is required;
for a required defect correction, identify one or more correction parameters for the required defect correction; and
send a correction command with the one or more correction parameters to the additive manufacturing device, the correction command causing the additive manufacturing device to perform a correction procedure to the detected defect in the sequential layer according to the correction parameters prior to moving on to a next sequential layer;
wherein the detected defect in the first product and the detected defect in the second product are detected by the defect analysis subsystem.