	US 12,280,414 B2
	Stamping assembly for preparing modular planar interconnect plate
Sea-Fue Wang, Taipei (TW); Fan-Ping Chen, Taoyuan (TW); and Hsi-Chuan Lu, Taipei (TW)
Assigned to NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY, Taipei (TW); and CERAM ENERGY TECHNOLOGY CO., LTD., Taoyuan (TW)
Filed by National Taipei University of Technology, Taipei (TW); and Ceram Energy Technology Co., Ltd., Taoyuan (TW)
Filed on Jun. 24, 2021, as Appl. No. 17/357,101.
Application 17/357,101 is a division of application No. 16/437,863, filed on Jun. 11, 2019, granted, now 11,075,391.
Claims priority of application No. 108104954 (TW), filed on Feb. 14, 2019.
Prior Publication US 2021/0320309 A1, Oct. 14, 2021
Int. Cl. B21D 22/06 (2006.01); B21D 22/02 (2006.01); B21D 28/34 (2006.01); B21D 37/10 (2006.01)

CPC B21D 22/06 (2013.01) [B21D 22/02 (2013.01); B21D 28/34 (2013.01); B21D 37/10 (2013.01)]

11 Claims

1. A stamping assembly for preparing a modular planar interconnect plate for a solid oxide fuel cell, comprising:

an upper die including:

an upper surface,

a lower surface opposite to said upper surface,

a plurality of lower depressions on said lower surface, said lower depressions being arranged into a plurality of rows of said lower depressions and a plurality of columns of said lower depressions,

said columns of said lower depressions being displaced from each other in a transverse direction, said lower depressions in each of said columns of said lower depressions being displaced from each other in a longitudinal direction, and

said rows of said lower depressions being displaced from each other in the longitudinal direction, said lower depressions in each of said rows of said lower depressions being displaced from each other in the transverse direction, and

a plurality of first guiding holes extending from said lower surface to said upper surface, said first guiding holes being arranged into a plurality of rows of said first guiding holes and a plurality of columns of said first guiding holes,

each of said columns of said first guiding holes being disposed between two adjacent ones of said columns of said lower depressions, said first guiding holes in each of said columns of said first guiding holes being staggered with said lower depressions of an adjacent one of said columns of said lower depressions,

in each of said columns of said first guiding holes, said first guiding holes including at least three said first guiding holes, a space between any two immediately adjacent ones of said at least three said first guiding holes having a same first distance, and

in each of said rows of said first guiding holes, said first guiding holes including at least three said first guiding holes, a space between any two immediately adjacent ones of said at least three said first guiding holes having a same second distance;

a lower die including:

a top surface,

a bottom surface opposite to said top surface,

a plurality of top depressions disposed on said top surface, said top depressions being arranged into a plurality of rows of said top depressions and a plurality of columns of said top depressions, each of said top depressions being disposed to register with a corresponding one of said first guiding holes, and

a plurality of second guiding holes extending from said bottom surface to said top surface, said second guiding holes being arranged into a plurality of rows of said second guiding holes and a plurality of columns of said second guiding holes,

each of said second guiding holes being disposed to register with a corresponding one of said lower depressions,

in each of said columns of said second guiding holes, said second guiding holes including at least three said second guiding holes, a space between any two immediately adjacent ones of said at least three said second guiding holes having a same third distance, and

in each of said rows of said second guiding holes, said second guiding holes including at least three said second guiding holes, a space between any two immediately adjacent ones of said at least three said fourth guiding holes having a same fourth distance;

a plurality of first pins each having a first pin head and a first pin body, and each being configured to fittingly engage with a corresponding one of said first guiding holes while permitting said first pin head to extend outwardly of said lower surface of said upper die by a first predetermined length; and

a plurality of second pins each having a second pin head and a second pin body, and each being configured to fittingly engage with a corresponding one of said second guiding holes while permitting said second pin head to extend outwardly of said top surface of said lower die by a second predetermined length,

wherein:

said plurality of said first pins are arranged into a first matrix that includes a plurality of columns of said first pins and a plurality of rows of said first pins;

said plurality of said second pins are arranged into a second matrix that includes a plurality of columns of said second pins and a plurality of rows of said second pins; and

each of said columns of said first pins is arranged between two adjacent ones of said columns of said second pins, such that said first pins in each of said columns of said first pins are staggered with said second pins in an adjacent one of said columns of said second pins.