US 12,280,399 B2
Method for manufacturing an acoustic wave transducing unit
Yuju Chen, Beijing (CN)
Assigned to BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
Appl. No. 17/426,863
Filed by BOE Technology Group Co., Ltd., Beijing (CN)
PCT Filed Oct. 27, 2020, PCT No. PCT/CN2020/123921
§ 371(c)(1), (2) Date Jul. 29, 2021,
PCT Pub. No. WO2022/087813, PCT Pub. Date May 5, 2022.
Prior Publication US 2022/0314277 A1, Oct. 6, 2022
Int. Cl. H04R 1/00 (2006.01); B06B 1/06 (2006.01); H10N 30/05 (2023.01); H10N 30/09 (2023.01); H10N 30/87 (2023.01); H10N 30/88 (2023.01)
CPC B06B 1/06 (2013.01) [H10N 30/05 (2023.02); H10N 30/09 (2023.02); H10N 30/87 (2023.02); H10N 30/88 (2023.02)] 10 Claims
OG exemplary drawing
 
1. A method for manufacturing an acoustic wave transducing unit, comprising:
forming a first electrode on a substrate;
sequentially forming a supporting layer and a diaphragm layer, wherein the supporting layer is located on a side of the first electrode away from the substrate, and the diaphragm layer is located on a side of the supporting layer away from the substrate;
the first electrode is lattice-matched with the supporting layer, the supporting layer is lattice-matched with the diaphragm layer, and a Photon Energy of the supporting layer is smaller than that of the diaphragm layer; the supporting layer comprises a sacrificial portion and a supporting portion surrounding the sacrificial portion;
forming a release hole, wherein the release hole penetrates through at least the diaphragm layer and is in contact with the sacrificial portion;
performing a laser etching on the sacrificial portion to decompose the sacrificial portion into a metal simple substance and a gas; and
removing the metal simple substance through the release hole so as to form a vibration chamber at a position of the sacrificial portion.