US 12,279,944 B2
Implantable superhydrophobic surfaces
Lukas Bluecher, Eurasburg (DE); and Michael Milbocker, Holliston, MA (US)
Assigned to BVW Holding AG, Cham (CH)
Filed by BVW Holding AG, Cham (CH)
Filed on Jul. 29, 2021, as Appl. No. 17/389,040.
Application 17/389,040 is a continuation of application No. 16/368,531, filed on Mar. 28, 2019, granted, now 11,141,260.
Application 16/368,531 is a continuation of application No. 13/745,381, filed on Jan. 18, 2013, granted, now 10,292,806, issued on May 21, 2019.
Claims priority of provisional application 61/589,907, filed on Jan. 11, 2013.
Prior Publication US 2021/0353400 A1, Nov. 18, 2021
Int. Cl. A61F 2/92 (2013.01); A61F 2/00 (2006.01); A61F 2/02 (2006.01); A61L 27/34 (2006.01); A61L 27/50 (2006.01); A61L 27/56 (2006.01); A61L 31/10 (2006.01); A61L 31/14 (2006.01); B29C 33/38 (2006.01)
CPC A61F 2/02 (2013.01) [A61F 2/0063 (2013.01); A61F 2/0077 (2013.01); A61L 27/34 (2013.01); A61L 27/50 (2013.01); A61L 27/56 (2013.01); A61L 31/10 (2013.01); A61L 31/14 (2013.01); A61L 31/146 (2013.01); B29C 33/3842 (2013.01); A61F 2002/0086 (2013.01); A61F 2002/009 (2013.01); A61F 2210/0004 (2013.01); A61L 2400/18 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A method of making a micropattern mold, the method comprising:
(a) providing a first substrate;
(b) creating a positive mold of a micropattern surface in the first substrate via photolithography;
(c) providing a second substrate;
(d) placing the second substrate in contact with the positive mold creating a negative mold of the micropattern surface;
(e) providing a third substrate;
(f) placing the third substrate in contact with the negative mold;
(g) transferring the micropattern surface of the negative mold to the third substrate to form a second positive mold;
(h) providing a fourth substrate;
(i) embossing the micropattern of the second positive mold onto the fourth substrate wherein the fourth substrate comprises a polymer being biodegradable and hydrophobic, and wherein the micropattern comprises a first micropattern having a first microtexture and a plurality of second microtextures, wherein the plurality of second microtextures is hierarchically disposed about the first microtexture, the first microtexture having a height ranging from 1 micron to 100 microns and a peak-to-peak pitch ranging from 100 microns to 500 microns between the first microtexture and an adjacent second microtexture, and the plurality of second microtextures having a peak-to-peak pitch of at least 10 microns, and wherein the fourth substrate comprises a superhydrophobic surface having a contact angle of 150° while further including a sessile drop contact hysteresis angle of at least 5°.