US D1,022,948 S
Headset
Tomohiro Shiraga, Kanagawa (JP); Chihlung Wu, Taoyuan (TW); and Shigeo Hara, Tokyo (JP)
Assigned to Audio-Technica Corporation, Tokyo (JP)
Filed by Audio-Technica Corporation, Tokyo (JP)
Filed on Nov. 28, 2022, as Appl. No. 29/793,488.
Claims priority of application No. 2022-015790 D (JP), filed on Jul. 25, 2022.
Term of patent 15 Years
LOC (14) Cl. 14 - 01
U.S. Cl. D14—205  [D14/206]
OG exemplary drawing
 
The ornamental design for a headset, as shown and described.