US 11,963,338 B2
Cooling system for electronic modules
Neil Edmunds, South Yorkshire (GB); Jason Matteson, South Yorkshire (GB); Nathan Longhurst, South Yorkshire (GB); and David Amos, South Yorkshire (GB)
Assigned to Iceotope Group Limited, South Yorkshire (GB)
Filed by ICEOTOPE GROUP LIMITED, South Yorkshire (GB)
Filed on Oct. 5, 2022, as Appl. No. 17/960,357.
Application 17/960,357 is a continuation of application No. 17/554,883, filed on Dec. 17, 2021, granted, now 11,490,546.
Application 17/554,883 is a continuation of application No. 17/611,392, previously published as PCT/GB2020/051245, filed on May 21, 2020.
Claims priority of application No. 1907182 (GB), filed on May 21, 2019; and application No. 1916767 (GB), filed on Nov. 18, 2019.
Prior Publication US 2023/0096875 A1, Mar. 30, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20772 (2013.01) 16 Claims
OG exemplary drawing
 
1. A system for cooling a plurality of electronic devices housed in a housing of an electronic module, the system comprising:
a first cooling circulatory arrangement, configured to circulate a first coolant from a first coolant supply between a first electronic device of the plurality of electronic devices and a heat exchanger, the first electronic device being thermally coupled to the first coolant such that heat is transferred from the first electronic device to the first coolant; and
a second cooling circulatory arrangement, configured to circulate a second coolant between a second electronic device of the plurality of electronic devices and the heat exchanger, the second electronic device being thermally coupled to the second coolant such that heat is transferred from the second electronic device to the second coolant;
wherein the first cooling circulatory arrangement and the second cooling circulatory arrangement are thermally coupled at least via the heat exchanger, such that heat is transferred from the first coolant to the second coolant via the heat exchanger; and
wherein the second cooling circulatory arrangement is connected to a second coolant supply, wherein the second cooling circulatory arrangement is configured to circulate the second coolant received from the second coolant supply between the second electronic device of the plurality of electronic devices and the heat exchanger, and to be returned to the second coolant supply.