US 11,963,324 B2
Structured fabrics for electronic devices
Yohji Hamada, Wakayama (JP); John J. Baker, Santa Clara, CA (US); Peter F. Coxeter, Sunnyvale, CA (US); Benjamin M. Rappoport, Santa Barbara, CA (US); and Joseph B. Walker, Campbell, CA (US)
Assigned to Apple Inc., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on Mar. 23, 2021, as Appl. No. 17/210,388.
Application 17/210,388 is a continuation of application No. 15/891,533, filed on Feb. 8, 2018, granted, now 10,966,332.
Application 15/891,533 is a continuation of application No. 14/579,953, filed on Dec. 22, 2014, granted, now 9,894,789, issued on Feb. 13, 2018.
Prior Publication US 2021/0212228 A1, Jul. 8, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 5/03 (2006.01); B32B 3/26 (2006.01); B32B 5/02 (2006.01); B32B 37/12 (2006.01); B32B 37/18 (2006.01); B32B 38/00 (2006.01)
CPC H05K 5/03 (2013.01) [B32B 3/266 (2013.01); B32B 5/026 (2013.01); B32B 37/12 (2013.01); B32B 37/18 (2013.01); B32B 38/0004 (2013.01); B32B 38/0008 (2013.01); B32B 2250/03 (2013.01); B32B 2305/182 (2013.01); B32B 2457/00 (2013.01); Y10T 428/24273 (2015.01); Y10T 428/24306 (2015.01); Y10T 428/24322 (2015.01)] 18 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a round housing:
a speaker in the round housing; and
a cover that wraps at least partially around the round housing, the cover comprising inner and outer fabric layers with openings through which sound from the speaker passes and an adhesive layer interposed between the inner and outer fabric layers, wherein the adhesive layer has additional openings that are aligned with the openings in the inner and outer fabric layers.