US 11,963,310 B2
Component carrier having component covered with ultra-thin transition layer
Mikael Tuominen, Pernio (FI); Seok Kim Tay, Singapore (SG); Kim Liu, Kunshan (CN); Artan Baftiri, Chongqing (CN); and Henry Guo, Suqian (CN)
Assigned to AT&S(China) Co. Ltd., Shanghai (CN)
Filed by AT&S (China) Co. Ltd., Shanghai (CN)
Filed on Dec. 31, 2020, as Appl. No. 17/139,871.
Claims priority of application No. 202010073861.8 (CN), filed on Jan. 22, 2020.
Prior Publication US 2021/0227702 A1, Jul. 22, 2021
Int. Cl. H05K 3/46 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01)
CPC H05K 3/467 (2013.01) [H05K 1/0271 (2013.01); H05K 1/181 (2013.01); H05K 1/183 (2013.01); H05K 1/185 (2013.01); H05K 3/4697 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of manufacturing a component carrier, comprising:
providing a laminated stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
at least partially covering a component with a transition layer having a thickness in a range from 1.0 nm to 100 nm;
assembling the component with the stack; and
at least partially covering a redistribution layer by the transition layer;
wherein the component carrier is a printed circuit board or IC substrate, and
wherein surfaces of the component except for at least one portion of at least one component pad being directly electrically connected to the at least one electrically conductive layer structure, are in direct contact with the transition layer.