	US 11,963,308 B2
	Method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer
Norbert Lützow, Berlin (DE); Wonjin Cho, Berlin (DE); Toshio Honda, Berlin (DE); Dirk Tews, Berlin (DE); Markku Lager, Berlin (DE); Felix Tang, Berlin (DE); Mirko Kloppisch, Berlin (DE); Aaron Hahn, Berlin (DE); Gabriela Schmidt, Berlin (DE); and Martin Thoms, Berlin (DE)
Assigned to Atotech Deutschland Gmbh & Co. KG, Berlin (DE)
Appl. No. 17/052,545
Filed by Atotech Deutschland GmbH, Berlin (DE)
PCT Filed May 6, 2019, PCT No. PCT/EP2019/061526 § 371(c)(1), (2) Date Nov. 3, 2020, PCT Pub. No. WO2019/215072, PCT Pub. Date Nov. 14, 2019.
Claims priority of application No. 18171175 (EP), filed on May 8, 2018.
Prior Publication US 2021/0251085 A1, Aug. 12, 2021
Int. Cl. H05K 3/38 (2006.01); C23C 22/52 (2006.01); C23G 1/10 (2006.01)

CPC H05K 3/385 (2013.01) [C23C 22/52 (2013.01); C23G 1/103 (2013.01); H05K 2203/124 (2013.01)]

20 Claims

1. A method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer, the method comprising in this order the steps:

(i) providing a non-conductive substrate comprising on at least one side said surface, said surface having a total surface area of copper or copper alloy,

(ii) contacting said substrate comprising said surface with an acidic aqueous non-etching protector solution comprising

(ii-a) one or more than one amino azole,

(ii-b) one or more than one organic acid and/or salts thereof,

(ii-c) one or more than one peroxide in a total amount of 0.4 wt-% or less, based on the total weight of the protector solution, and

(ii-d) one or more than one inorganic acid in a total amount of 0 to 0.01 wt %, based on the total weight of the protector solution,

wherein during step (ii) the total surface area of said surface is not increased upon contacting with the protector solution, and

wherein the protector solution is substantially free of chloride and fluoride ions.