US 11,963,300 B2
Panel device and manufacturing method of panel device
Chun-Yueh Hou, Hsinchu (TW); Hao-An Chuang, Hsinchu (TW); Fan-Yu Chen, Hsinchu (TW); Hsi-Hung Chen, Hsinchu (TW); Yun Cheng, Hsinchu (TW); Wen-Chang Hsieh, Hsinchu (TW); and Chih-Wen Lu, Hsinchu (TW)
Assigned to Au Optronics Corporation, Hsinchu (TW)
Filed by Au Optronics Corporation, Hsinchu (TW)
Filed on Jul. 9, 2021, as Appl. No. 17/371,135.
Claims priority of provisional application 63/065,641, filed on Aug. 14, 2020.
Claims priority of application No. 110112830 (TW), filed on Apr. 9, 2021.
Prior Publication US 2022/0053638 A1, Feb. 17, 2022
Int. Cl. H05K 1/11 (2006.01); H05K 3/22 (2006.01); H05K 3/46 (2006.01)
CPC H05K 1/111 (2013.01) [H05K 3/22 (2013.01); H05K 3/4644 (2013.01); H05K 2201/10227 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A panel device, comprising:
a substrate, having a first surface and a second surface connected to the first surface, wherein a normal direction of the second surface is different from a normal direction of the first surface;
a conductor pad, disposed on the first surface of the substrate;
a turning wire, disposed on the substrate and extending from the first surface to the second surface, wherein the turning wire comprises a wiring layer in contact with the conductor pad and a wire covering layer covering the wiring layer; and
a circuit board, bonded to the wire covering layer and electrically connected to the wire covering layer,
wherein an area of the projection of the wire covering layer on the first surface is greater than an area of the projection of the wiring layer on the first surface.