CPC H05K 1/0203 (2013.01) [G06F 1/203 (2013.01); H05K 7/2039 (2013.01); H05K 2201/10128 (2013.01)] | 25 Claims |
1. An assembly comprising:
a standoff disposed on a perimeter of a circuit board; and
a thermal module mechanically coupled with the standoff, the thermal module comprising:
a first portion that covers a heat-generating component of the circuit board, and
a second portion that extends laterally beyond the standoff; and
a bracket coupled with the thermal module at the second portion, the bracket comprising a bend, wherein the bracket is configured to secure with a component based on the bend.
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