US 11,963,288 B2
Thermal module for a circuit board
Trevor J. Edmonds, San Francisco, CA (US); Jay S. Nigen, Los Gatos, CA (US); Richard D. Kosoglow, San Jose, CA (US); and Ron A. Hopkinson, Campbell, CA (US)
Assigned to Apple Inc., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on Jun. 17, 2022, as Appl. No. 17/843,884.
Prior Publication US 2023/0413416 A1, Dec. 21, 2023
Int. Cl. H05K 1/02 (2006.01); G06F 1/20 (2006.01); H05K 7/20 (2006.01)
CPC H05K 1/0203 (2013.01) [G06F 1/203 (2013.01); H05K 7/2039 (2013.01); H05K 2201/10128 (2013.01)] 25 Claims
OG exemplary drawing
 
1. An assembly comprising:
a standoff disposed on a perimeter of a circuit board; and
a thermal module mechanically coupled with the standoff, the thermal module comprising:
a first portion that covers a heat-generating component of the circuit board, and
a second portion that extends laterally beyond the standoff; and
a bracket coupled with the thermal module at the second portion, the bracket comprising a bend, wherein the bracket is configured to secure with a component based on the bend.