US 11,962,129 B2
Systems and methods for laser diode array having integrated microchannel cooling
Jack Kotovsky, Alameda, CA (US); Salmaan H. Baxamusa, Livermore, CA (US); Clint D. Frye, Livermore, CA (US); Ian Seth Ladner, Livermore, CA (US); Thomas M. Spinka, Livermore, CA (US); Devin Joseph Funaro, Livermore, CA (US); David Ryan Hobby, Wellington, CO (US); Caleb Del Anderson, Fort Collins, CO (US); and Todd Bandhauer, Fort Collins, CO (US)
Assigned to Lawrence Livermore National Security, LLC, Livermore, CA (US); and Colorado State University Research Foundation, Fort Collins, CO (US)
Filed by Lawrence Livermore National Security, LLC, Livermore, CA (US); and Colorado State University Research Foundation, Fort Collins, CO (US)
Filed on Apr. 9, 2021, as Appl. No. 17/227,132.
Prior Publication US 2022/0329048 A1, Oct. 13, 2022
Int. Cl. H01S 5/40 (2006.01); H01S 5/024 (2006.01)
CPC H01S 5/4025 (2013.01) [H01S 5/02423 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A laser diode system comprising:
at least one substrate having a laser diode emitter supported on a surface of the at least one substrate, the laser diode emitter emitting a laser beam from a facet at one end of the laser diode emitter, along an axis parallel to the surface of the at least one substrate;
a cooling subsystem disposed in contact with the surface of the at least one substrate of the laser diode emitter, and being independent of the substrate the cooling subsystem including a plurality of cooling fins spaced laterally of the substrate and forming a plurality of elongated cooling channels for circulating a cooling fluid therethrough to cool the laser diode emitter and the at least one substrate supporting the laser diode emitter; and
wherein the cooling fluid also flows over the facet of the laser diode emitter.