US 11,962,116 B2
Resistance soldering device and method of using said device
William Falk, Warwick, RI (US)
Assigned to APTIV TECHNOLOGIES AG, Schaffhausen (CH)
Filed by Aptiv Technologies AG, Schaffhausen (CH)
Filed on Jan. 27, 2021, as Appl. No. 17/159,421.
Claims priority of provisional application 62/983,782, filed on Mar. 2, 2020.
Prior Publication US 2021/0273392 A1, Sep. 2, 2021
Int. Cl. H01R 43/02 (2006.01); B23K 1/00 (2006.01); B23K 3/03 (2006.01)
CPC H01R 43/0214 (2013.01) [B23K 1/0004 (2013.01); B23K 3/033 (2013.01); B23K 3/0392 (2013.01); H01R 43/0235 (2013.01); H01R 43/0242 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A resistance soldering device configured for using with an electrical terminal having a first surface and a second surface opposite the first surface on which a layer of a solder composition is disposed, said resistance soldering device comprising:
an electrode having a first electrical conductor configured to be connected to a positive pole of an electrical power supply, a second electrical conductor configured to be connected to a negative pole of the electrical power supply and an electrically resistive bridge interconnecting the first and second electrical conductors, wherein the bridge has a fixed end connected to the first electrical conductor and a free end configured to directly contact the first surface of the electrical terminal and wherein the second electrical conductor contacts the bridge at a location closer to the free end than the fixed end, wherein the bridge deflects the second electrical conductor, thereby providing a contact spring force between the bridge and the second electrical conductor, and wherein the second electrical conductor defines a V-shaped notch at a contact point between the second electrical conductor and the bridge.