CPC H01L 29/82 (2013.01) [G01D 5/147 (2013.01); G01R 33/0047 (2013.01); G01R 33/0052 (2013.01); G01R 33/06 (2013.01); G01R 15/207 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/00011 (2013.01)] | 16 Claims |
1. An integrated circuit package comprising:
a lead frame having a first surface and a second opposing surface;
a semiconductor die having a first, active surface in which circuitry is disposed and a second opposing surface attached to the first surface of the lead frame;
a magnet attached to the second surface of the lead frame and having a non-contiguous central region and at least one channel extending laterally from the central region; and
an overmold material forming an enclosure surrounding the magnet, semiconductor die, and a portion of the lead frame.
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