US 11,961,920 B2
Integrated circuit package with magnet having a channel
Ravi Vig, Concord, NH (US); William P. Taylor, Amherst, NH (US); Paul A. David, Bow, NH (US); P. Karl Scheller, Dover, NH (US); and Andreas P. Friedrich, Metz-Tessy (FR)
Assigned to Allegro MicroSystems, LLC, Manchester, NH (US)
Filed by Allegro MicroSystems, LLC, Manchester, NH (US)
Filed on Apr. 26, 2023, as Appl. No. 18/307,057.
Application 18/307,057 is a division of application No. 17/806,758, filed on Jun. 14, 2022, granted, now 11,677,032.
Application 17/806,758 is a division of application No. 17/130,085, filed on Dec. 22, 2020, granted, now 11,444,209, issued on Sep. 13, 2022.
Application 17/130,085 is a division of application No. 16/252,789, filed on Jan. 21, 2019, granted, now 10,916,665, issued on Feb. 9, 2021.
Application 16/252,789 is a division of application No. 15/618,251, filed on Jun. 9, 2017, granted, now 10,230,006, issued on Mar. 12, 2019.
Application 15/618,251 is a division of application No. 13/748,999, filed on Jan. 24, 2013, granted, now 9,812,588, issued on Nov. 7, 2017.
Application 13/748,999 is a continuation in part of application No. 13/424,618, filed on Mar. 20, 2012, granted, now 10,234,513, issued on Mar. 19, 2019.
Prior Publication US 2023/0261118 A1, Aug. 17, 2023
Int. Cl. G01R 33/06 (2006.01); G01D 5/14 (2006.01); G01R 15/20 (2006.01); G01R 33/00 (2006.01); H01L 29/82 (2006.01)
CPC H01L 29/82 (2013.01) [G01D 5/147 (2013.01); G01R 33/0047 (2013.01); G01R 33/0052 (2013.01); G01R 33/06 (2013.01); G01R 15/207 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/00011 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An integrated circuit package comprising:
a lead frame having a first surface and a second opposing surface;
a semiconductor die having a first, active surface in which circuitry is disposed and a second opposing surface attached to the first surface of the lead frame;
a magnet attached to the second surface of the lead frame and having a non-contiguous central region and at least one channel extending laterally from the central region; and
an overmold material forming an enclosure surrounding the magnet, semiconductor die, and a portion of the lead frame.