US 11,961,831 B2
Electronic package, semiconductor package structure, and method for manufacturing the semiconductor package structure
You-Lung Yen, Taoyuan (TW); and Bernd Karl Appelt, Holly Springs, NC (US)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Aug. 20, 2021, as Appl. No. 17/408,297.
Prior Publication US 2023/0058358 A1, Feb. 23, 2023
Int. Cl. H01L 25/18 (2023.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01)
CPC H01L 25/18 (2013.01) [H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H01L 23/49811 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 24/48 (2013.01); H01L 25/50 (2013.01); H01L 2224/48141 (2013.01); H01L 2224/48227 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic package, comprising:
a carrier having a first face and a second face opposite to the first face;
a first electronic component adjacent to the first face of the carrier;
an electrical extension structure adjacent to the first face of the carrier and defining a space with the carrier for accommodating the first electronic component, wherein the electrical extension structure is configured to connect the carrier with an external electronic component; and
an encapsulant encapsulating the first electronic component and at least a portion of the electrical extension structure,
wherein the carrier comprises a first opening connecting the first face and the second face, and a first type bonding wire passes through the first opening and connects to the first electronic component.