US 11,961,808 B2
Electronic package structure with reinforcement element
Wei-Jen Wang, Kaohsiung (TW); Po-Jen Cheng, Kaohsiung (TW); Fu-Yuan Chen, Kaohsiung (TW); and Yi-Hsin Cheng, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Oct. 14, 2021, as Appl. No. 17/501,953.
Prior Publication US 2023/0124000 A1, Apr. 20, 2023
Int. Cl. H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01)
CPC H01L 23/562 (2013.01) [H01L 23/49811 (2013.01); H01L 23/5386 (2013.01); H01L 24/14 (2013.01)] 8 Claims
OG exemplary drawing
 
1. An electronic package structure, comprising:
an electronic structure;
a wiring structure disposed over the electronic structure;
a bonding element connecting the wiring structure and the electronic structure; and
a reinforcement element attached to the wiring structure;
wherein an elevation difference between a highest point and a lowest point of a surface of the wiring structure facing the electronic structure is less than a height of the bonding element,
wherein the bonding element and the reinforcement layer are disposed adjacent to two opposite sides of the wiring structure, respectively, and
wherein a hardness of the reinforcement element is greater than a hardness of the wiring structure.