US 11,961,676 B2
Electronic device
Akihiro Masuda, Tokyo (JP); Shinya Ito, Tokyo (JP); Norihisa Ando, Tokyo (JP); Kosuke Yazawa, Tokyo (JP); Yoshiki Satou, Tokyo (JP); and Katsumi Kobayashi, Tokyo (JP)
Assigned to TDK CORPORATION, Tokyo (JP)
Filed by TDK CORPORATION, Tokyo (JP)
Filed on Jun. 23, 2022, as Appl. No. 17/847,717.
Claims priority of application No. 2021-114539 (JP), filed on Jul. 9, 2021.
Prior Publication US 2023/0010668 A1, Jan. 12, 2023
Int. Cl. H01G 4/224 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/224 (2013.01) [H01G 4/30 (2013.01)] 10 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a chip component;
an accommodation recess accommodating the chip component; and
a case including a protrusion partitioning the accommodation recess into a first accommodation space and a second accommodation space along a first axis direction; wherein
the protrusion includes a first protrusion and a second protrusion disposed away from the first protrusion along a second axis direction orthogonal to the first axis direction; and
the first protrusion and the second protrusion are disposed with a communication space provided between the first protrusion and the second protrusion, so that the first accommodation space and the second accommodation space communicate.