CPC H01G 4/224 (2013.01) [H01G 4/30 (2013.01)] | 10 Claims |
1. An electronic device comprising:
a chip component;
an accommodation recess accommodating the chip component; and
a case including a protrusion partitioning the accommodation recess into a first accommodation space and a second accommodation space along a first axis direction; wherein
the protrusion includes a first protrusion and a second protrusion disposed away from the first protrusion along a second axis direction orthogonal to the first axis direction; and
the first protrusion and the second protrusion are disposed with a communication space provided between the first protrusion and the second protrusion, so that the first accommodation space and the second accommodation space communicate.
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