CPC G06F 13/4291 (2013.01) [G06F 13/4286 (2013.01); H01L 25/0652 (2013.01)] | 20 Claims |
1. A semiconductor package for skew matching in a die-to-die interface, comprising:
a first die;
a second die aligned with the first die such that each connection point of a first plurality of connection points of the first die is equidistant to a corresponding connection point of a second plurality of connection points of the second die, wherein a transmit block of the first die is linearly aligned with a receive block of the second die and a transmit block of the second die is linearly aligned with a receive block of the first die; and
a plurality of connection paths of a same length, wherein each connection path of the plurality of connection paths couples a respective connection point of the first plurality of connection points to the corresponding connection point of the second plurality of connection points.
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8. A method of skew matching in a die-to-die interface, the method comprising:
aligning a first die with a second die such that each connection point of a first plurality of connection points of the first die is equidistant to a corresponding connection point of a second plurality of connection points of the second die, wherein, after aligning the first die with the second die, a transmit block of the first die is linearly aligned with a receive block of the second die and a transmit block of the second die is linearly aligned with a receive block of the first die; and
coupling each connection point of the first plurality of connection points to the corresponding connection point of the second plurality of connection points using a connection path, wherein each of the connection paths comprises a same length.
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15. An apparatus for skew matching in a die-to-die interface, comprising:
computer memory;
a semiconductor package operatively coupled to the computer memory, comprising:
a first die;
a second die aligned with the first die such that each connection point of a first plurality of connection points of the first die is equidistant to a corresponding connection point of a second plurality of connection points of the second die, wherein a transmit block of the first die is linearly aligned with a receive block of the second die and a transmit block of the second die is linearly aligned with a receive block of the first die; and
a plurality of connection paths of a same length, wherein each connection path of the plurality of connection paths couples a respective connection point of the first plurality of connection points to the corresponding connection point of the second plurality of connection points.
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