US 11,960,435 B2
Skew matching in a die-to-die interface
Pradeep Jayaraman, Santa Clara, CA (US); Dean Gonzales, Fort Collins, CO (US); Gerald R. Talbot, Boxborough, MA (US); Ramon A. Mangaser, Boxborough, MA (US); Michael J. Tresidder, Austin, TX (US); Prasant Kumar Vallur, Bangalore (IN); Srikanth Reddy Gruddanti, Bangalore (IN); Krishna Reddy Mudimela Venkata, Bangalore (IN); and David H. McIntyre, Santa Clara, CA (US)
Assigned to ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US)
Filed by ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US)
Filed on Mar. 10, 2022, as Appl. No. 17/692,147.
Claims priority of application No. 202111059016 (IN), filed on Dec. 17, 2021.
Prior Publication US 2023/0195678 A1, Jun. 22, 2023
Int. Cl. G06F 13/42 (2006.01); H01L 25/065 (2023.01)
CPC G06F 13/4291 (2013.01) [G06F 13/4286 (2013.01); H01L 25/0652 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package for skew matching in a die-to-die interface, comprising:
a first die;
a second die aligned with the first die such that each connection point of a first plurality of connection points of the first die is equidistant to a corresponding connection point of a second plurality of connection points of the second die, wherein a transmit block of the first die is linearly aligned with a receive block of the second die and a transmit block of the second die is linearly aligned with a receive block of the first die; and
a plurality of connection paths of a same length, wherein each connection path of the plurality of connection paths couples a respective connection point of the first plurality of connection points to the corresponding connection point of the second plurality of connection points.
 
8. A method of skew matching in a die-to-die interface, the method comprising:
aligning a first die with a second die such that each connection point of a first plurality of connection points of the first die is equidistant to a corresponding connection point of a second plurality of connection points of the second die, wherein, after aligning the first die with the second die, a transmit block of the first die is linearly aligned with a receive block of the second die and a transmit block of the second die is linearly aligned with a receive block of the first die; and
coupling each connection point of the first plurality of connection points to the corresponding connection point of the second plurality of connection points using a connection path, wherein each of the connection paths comprises a same length.
 
15. An apparatus for skew matching in a die-to-die interface, comprising:
computer memory;
a semiconductor package operatively coupled to the computer memory, comprising:
a first die;
a second die aligned with the first die such that each connection point of a first plurality of connection points of the first die is equidistant to a corresponding connection point of a second plurality of connection points of the second die, wherein a transmit block of the first die is linearly aligned with a receive block of the second die and a transmit block of the second die is linearly aligned with a receive block of the first die; and
a plurality of connection paths of a same length, wherein each connection path of the plurality of connection paths couples a respective connection point of the first plurality of connection points to the corresponding connection point of the second plurality of connection points.