US 11,960,051 B2
Meta-lens structure and method of fabricating the same
Shiyang Zhu, Singapore (SG); Chih-Kuo Tseng, Singapore (SG); Ting Hu, Singapore (SG); Zhengji Xu, Singapore (SG); Yuan Dong, Singapore (SG); and Alex Yuandong Gu, Singapore (SG)
Assigned to Agency for Science, Technology and Research, Singapore (SG)
Appl. No. 17/292,124
Filed by Agency for Science, Technology and Research, Singapore (SG)
PCT Filed Oct. 14, 2019, PCT No. PCT/SG2019/050510
§ 371(c)(1), (2) Date May 7, 2021,
PCT Pub. No. WO2020/101568, PCT Pub. Date May 22, 2020.
Claims priority of application No. 10201810181P (SG), filed on Nov. 15, 2018.
Prior Publication US 2021/0396910 A1, Dec. 23, 2021
Int. Cl. G02B 1/00 (2006.01); G02B 1/02 (2006.01)
CPC G02B 1/002 (2013.01) [G02B 1/02 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method of fabricating a meta-lens structure, the method comprising:
forming a first dielectric layer in contact with a silicon wafer;
forming a second dielectric layer in contact with the first dielectric layer, a refractive index of the second dielectric layer different from a refractive index of the first dielectric layer;
patterning the second dielectric layer; and
removing at least a portion of the silicon wafer to expose the first dielectric layer,
wherein the silicon wafer is entirely removed;
wherein the method further comprises forming a layer of silicon oxide in contact with the second dielectric layer after the second dielectric layer is patterned and before the silicon wafer is entirely removed; and
wherein the method also comprises bonding a wafer to the silicon oxide layer after the silicon oxide layer is formed, and before the silicon wafer is entirely removed.