US 11,959,806 B2
MEMS sensors and systems
John Hong, San Diego, CA (US); Bing Wen, San Diego, CA (US); Edward Chan, San Diego, CA (US); Tallis Chang, San Diego, CA (US); and Sean Andrews, San Diego, CA (US)
Assigned to Obsidian Sensors, Inc., San Diego, CA (US)
Filed by Obsidian Sensors, Inc., San Diego, CA (US)
Filed on Apr. 10, 2023, as Appl. No. 18/132,773.
Application 18/132,773 is a continuation of application No. 17/267,789, granted, now 11,624,657, issued on Apr. 11, 2023, previously published as PCT/US2019/046066, filed on Aug. 9, 2019.
Claims priority of provisional application 62/765,151, filed on Aug. 17, 2018.
Claims priority of provisional application 62/717,676, filed on Aug. 10, 2018.
Prior Publication US 2023/0314228 A1, Oct. 5, 2023
Int. Cl. G01J 5/20 (2006.01); B81B 3/00 (2006.01); G01J 5/02 (2022.01); H04N 23/11 (2023.01)
CPC G01J 5/024 (2013.01) [B81B 3/0029 (2013.01); G01J 5/20 (2013.01); H04N 23/11 (2023.01); B81B 2201/047 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A microelectromechanical system, comprising:
a substrate comprising a surface;
a lid comprising a surface;
spacers separating the lid and the substrate, wherein each of the spacers is coupled to the surface of the substrate and the surface of the lid;
a cavity defined by the spacers, the surface of the lid, and the surface of the substrate;
a pixel in the cavity to detect radiation, the pixel positioned on the surface of the substrate; and
a reflector comprising an antenna structure and a transmission line to:
direct the radiation to the pixel; and
shift a phase of the radiation.