US 11,959,156 B2
Cubic boron nitride sintered material and cutting tool including same
Yuichiro Watanabe, Osaka (JP); Katsumi Okamura, Osaka (JP); Akito Ishii, Osaka (JP); Yoshiki Asakawa, Hyogo (JP); Akihiko Ueda, Hyogo (JP); Satoru Kukino, Hyogo (JP); and Hisaya Hama, Hyogo (JP)
Assigned to Sumitomo Electric Industries, Ltd., Osaka (JP); and SUMITOMO ELECTRIC HARDMETAL CORP., Hyogo (JP)
Appl. No. 17/910,801
Filed by SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP); and SUMITOMO ELECTRIC HARDMETAL CORP., Hyogo (JP)
PCT Filed Jul. 30, 2021, PCT No. PCT/JP2021/028503
§ 371(c)(1), (2) Date May 3, 2023,
PCT Pub. No. WO2022/025293, PCT Pub. Date Feb. 3, 2022.
Claims priority of application No. 2020-130673 (JP), filed on Jul. 31, 2020.
Prior Publication US 2023/0295779 A1, Sep. 21, 2023
Int. Cl. B23B 27/14 (2006.01); B22F 7/00 (2006.01); C22C 29/16 (2006.01)
CPC C22C 29/16 (2013.01) [B22F 7/008 (2013.01); B23B 27/148 (2013.01); B22F 2207/01 (2013.01); B22F 2301/205 (2013.01); B22F 2302/205 (2013.01); B23B 2226/125 (2013.01)] 6 Claims
 
1. A cubic boron nitride sintered material comprising: cubic boron nitride particles in an amount of 70 vol % or more and less than 100 vol %, and a bonding material, wherein
the bonding material comprises, as constituent elements, cobalt, aluminum, and at least one first metallic element selected from the group consisting of titanium, zirconium, vanadium, niobium, hafnium, tantalum, chromium, rhenium, molybdenum, and tungsten;
the cubic boron nitride sintered material has a first interface region that is a region sandwiched between an interface formed between a surface of the cubic boron nitride particles and the bonding material, and a first virtual line passing through the bonding material at a point 10 nm apart from the interface to on the bonding material side; and
wherein an element that is present at the highest concentration among the first metallic elements in the first interface region is defined as a first element, an atomic concentration of the first element in the first interface region is higher than an atomic concentration of the first element in the bonding material outside the first interface region.