US 11,958,269 B2
Laminated member
Shuhei Ogawa, Tokyo (JP); Shuhei Nomura, Tokyo (JP); and Norihito Nakazawa, Tokyo (JP)
Assigned to AGC Inc., Tokyo (JP)
Filed by AGC Inc., Tokyo (JP)
Filed on Jan. 14, 2022, as Appl. No. 17/575,827.
Application 17/575,827 is a continuation of application No. PCT/JP2020/027398, filed on Jul. 14, 2020.
Claims priority of application No. 2019-137123 (JP), filed on Jul. 25, 2019.
Prior Publication US 2022/0134713 A1, May 5, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. B32B 15/04 (2006.01); B32B 9/04 (2006.01); B32B 17/06 (2006.01); B32B 17/10 (2006.01); B32B 27/28 (2006.01)
CPC B32B 17/10082 (2013.01) [B32B 9/045 (2013.01); B32B 17/10 (2013.01); B32B 17/10036 (2013.01); B32B 27/28 (2013.01); B32B 2250/03 (2013.01); B32B 2307/30 (2013.01); B32B 2307/412 (2013.01); B32B 2307/546 (2013.01); B32B 2307/72 (2013.01); B32B 2307/732 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A laminated member comprising:
a glass member of which a linear transmittance at a wavelength of 850 nm is 80% or more;
a bonding layer provided on or above the glass member, the bonding layer being constituted by a resin; and
a Si—SiC member provided on or above the bonding layer and wherein, a density of the laminated member is 2.45 g/cm3 to 2.95 g/cm3.