US D1,070,863 S
Heat sink for memory module
Hui-Hsin Lu, Hsinchu (TW)
Assigned to KINGSTON DIGITAL, INC., Fountain Valley, CA (US)
Filed by Kingston Digital, Inc., Fountain Valley, CA (US)
Filed on Dec. 20, 2022, as Appl. No. 29/863,507.
Term of patent 15 Years
LOC (15) Cl. 14 - 05
U.S. Cl. D14—435  [D13/179]
OG exemplary drawing
 
The ornamental design for a heat sink for memory module, as shown and described.