CPC H10K 30/10 (2023.02) [H10K 30/88 (2023.02)] | 18 Claims |
1. A colloidal quantum dot device comprising:
an integrated circuit;
a colloidal quantum dot structure on the integrated circuit;
an encapsulation layer on the colloidal quantum dot structure, the encapsulation layer comprising an atomic layer deposition (ALD) layer, wherein the ALD layer is directly on the colloidal quantum dot structure;
an epoxy layer on the ALD layer; and
a glass layer on the epoxy layer.
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