US 12,279,467 B2
Substrate, backlight module, and display apparatus
Ke Wang, Beijing (CN); Zhanfeng Cao, Beijing (CN); Qi Qi, Beijing (CN); and Yan Qu, Beijing (CN)
Assigned to BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
Appl. No. 17/769,022
Filed by BOE Technology Group Co., Ltd., Beijing (CN)
PCT Filed Jun. 11, 2021, PCT No. PCT/CN2021/099789
§ 371(c)(1), (2) Date Apr. 14, 2022,
PCT Pub. No. WO2021/259085, PCT Pub. Date Dec. 30, 2021.
Claims priority of application No. 202021171850.5 (CN), filed on Jun. 22, 2020.
Prior Publication US 2024/0105893 A1, Mar. 28, 2024
Int. Cl. H10H 20/857 (2025.01); H01L 25/16 (2023.01)
CPC H10H 20/857 (2025.01) [H01L 25/167 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A substrate, wherein the substrate is configured to display or provide a backlight, and the substrate comprises: a bonding region and a plurality of light-emitting regions;
each of the plurality of light-emitting regions comprises a first metal layer and a first conductive adhesive located on the first metal layer, and the first conductive adhesive is a photo-curing conductive adhesive; and
the bonding region comprises a second metal layer and a second conductive adhesive located on the second metal layer;
each of the plurality of light-emitting regions further comprises a light-emitting structure, a first insulation layer and a first connection hole, the first insulation layer is located between the light-emitting structure and the first metal layer, the first connection hole penetrates through the first insulation layer, the first conductive adhesive is located in the first connection hole, and the light-emitting structure is electrically connected to the first metal layer via the first conductive adhesive; and
the bonding region further comprises a circuit board, a second insulation layer and a second connection hole, the second insulation layer is located between the circuit board and the second metal layer, the second connection hole penetrates through the second insulation layer, the second conductive adhesive is located in the second connection hole, and the circuit board is electrically connected to the second metal layer via the second conductive adhesive.