US 12,279,453 B2
Semiconductor device
Guk Hwan Kim, Cheongju-si (KR)
Assigned to Magnachip Mixed-Signal, Ltd., Cheongju-si (KR)
Filed by Magnachip Mixed-Signal, Ltd., Cheongju-si (KR)
Filed on Jul. 15, 2021, as Appl. No. 17/376,557.
Claims priority of application No. 10-2020-0100930 (KR), filed on Aug. 12, 2020.
Prior Publication US 2022/0052156 A1, Feb. 17, 2022
Int. Cl. H01L 29/06 (2006.01); H01L 29/78 (2006.01); H10D 30/65 (2025.01); H10D 62/10 (2025.01); H10D 64/27 (2025.01)
CPC H10D 62/116 (2025.01) [H10D 30/65 (2025.01); H10D 64/516 (2025.01)] 30 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a source region, a drain region, and a gate dielectric layer formed on a substrate;
a body region formed to surround the source region;
a gate electrode formed on the gate dielectric layer;
a first dielectric pattern, formed contacting a sidewall of the gate electrode, extending from the source region onto a portion of an upper surface of the gate electrode;
a spacer formed on another sidewall of the gate electrode between the gate electrode and the drain region;
a lightly doped drain (LDD) region formed below the gate dielectric layer to overlap a portion of the gate dielectric layer and a portion of the first dielectric pattern; and
a gate silicide layer formed between the first dielectric pattern and the spacer,
wherein the source region and the body region have different conductivity types.