US 12,279,435 B2
Semiconductor device
Kyunghwan Lee, Seoul (KR); Yongseok Kim, Suwon-si (KR); Hyuncheol Kim, Seoul (KR); Jongman Park, Hwaseong-si (KR); and Dongsoo Woo, Seoul (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Mar. 1, 2022, as Appl. No. 17/683,460.
Claims priority of application No. 10-2021-0090249 (KR), filed on Jul. 9, 2021.
Prior Publication US 2023/0011675 A1, Jan. 12, 2023
Int. Cl. H10B 51/20 (2023.01); H10B 51/10 (2023.01); H10B 51/40 (2023.01)
CPC H10B 51/20 (2023.02) [H10B 51/10 (2023.02); H10B 51/40 (2023.02)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
first conductive lines provided on a substrate and spaced apart from each other in a first direction, the first direction being perpendicular to a top surface of the substrate;
second conductive lines spaced apart from the first conductive lines in a second direction, the second direction being parallel to the top surface of the substrate;
a gate electrode disposed between the first conductive lines and the second conductive lines, and extended in the first direction;
channel patterns provided to enclose a side surface of the gate electrode, and spaced apart from each other in the first direction;
a ferroelectric pattern between each of the channel patterns and the gate electrode; and
a gate insulating pattern between each of the channel patterns and the ferroelectric pattern,
wherein each of the channel patterns is connected to a corresponding one of the first conductive lines and a corresponding one of the second conductive lines.