US 12,279,403 B2
Power supply system for supplying power to network device
Kai Dong, Shanghai (CN); Yong Huang, Shanghai (CN); Zhongwei Ke, Shanghai (CN); and Jinfa Zhang, Shanghai (CN)
Assigned to Delta Electronics (Shanghai) Co., Ltd., Shanghai (CN)
Filed by Delta Electronics (Shanghai) Co.,Ltd., Shanghai (CN)
Filed on Jun. 26, 2023, as Appl. No. 18/340,907.
Application 18/340,907 is a continuation of application No. 17/447,057, filed on Sep. 7, 2021, granted, now 11,737,250.
Claims priority of application No. 202011122732.X (CN), filed on Oct. 20, 2020.
Prior Publication US 2023/0337405 A1, Oct. 19, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 7/20 (2006.01); H02M 1/32 (2007.01); H02M 3/00 (2006.01)
CPC H05K 7/20927 (2013.01) [H02M 3/003 (2021.05); H02M 1/327 (2021.05)] 20 Claims
OG exemplary drawing
 
1. A power supply system for supplying power to a device, comprising:
a housing;
a power supply module without a fan, comprising:
a primary circuit comprising at least one primary switch and configured to receive an AC input voltage and convert the AC input voltage into a first voltage;
a transformer comprising a primary winding and a secondary winding, and configured to convert the first voltage into a second voltage, wherein the primary winding is coupled to the primary circuit; and
a secondary circuit comprising at least one secondary switch and configured to convert the second voltage into a DC output voltage and supply power to the device, wherein the secondary circuit is coupled to the secondary winding, the secondary switch adopts surface-mounted type (SMT) package, and a power density of the power supply module is greater than or equal to 60 W/inch3; and
an accommodating space between the housing and the power supply module, wherein the accommodating space is filled with a liquid coolant for cooling the power supply module,
wherein a wire-diameter current density of the secondary winding is greater than or equal to 15A/mm2.