US 12,279,380 B2
Method for producing a circuit board arrangement
Rafael Del Rey, Frankfurt am Main (DE); and Markus Bebendorf, Frankfurt am Main (DE)
Assigned to CONTINENTAL AUTOMOTIVE GMBH, Hannover (DE)
Appl. No. 17/273,133
Filed by Continental Automotive GmbH, Hannover (DE)
PCT Filed Sep. 10, 2019, PCT No. PCT/EP2019/074014
§ 371(c)(1), (2) Date Mar. 3, 2021,
PCT Pub. No. WO2020/053160, PCT Pub. Date Mar. 19, 2020.
Claims priority of application No. 10 2018 215 672.7 (DE), filed on Sep. 14, 2018.
Prior Publication US 2021/0329793 A1, Oct. 21, 2021
Int. Cl. H05K 3/36 (2006.01); H05K 3/12 (2006.01); H05K 3/34 (2006.01)
CPC H05K 3/363 (2013.01) [H05K 3/1216 (2013.01); H05K 3/3485 (2020.08); H05K 2201/09136 (2013.01); H05K 2201/10628 (2013.01); H05K 2201/10734 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A method for producing a circuit board arrangement, comprising:
providing a first circuit board substrate,
providing a second circuit board substrate, which is arranged substantially planar-parallel to the first circuit board substrate, the first circuit board substrate having an underside and the second circuit board substrate having an upper face, the upper face and the underside being arranged opposite one another,
providing first terminal contacts, which are applied to the underside of the first circuit board substrate,
providing second terminal contacts, which are applied to the upper face of the second circuit board substrate,
applying solder paste cylinders to the first terminal contacts, the solder paste cylinders being applied directly to the first terminal contacts by a solder-paste application process with solder paste, the applied solder paste cylinders having in each case a solder-paste-cylinder upper face,
arranging the second terminal contacts of the second circuit board substrate directly on the solder-paste-cylinder upper faces of the solder paste cylinders, and
when applying the solder paste cylinders by the solder-paste application process, simultaneously applying at least one surface-mountable terminal area made of solder paste for fastening Surface Mount Device (SMD) components to a terminal pad arranged on the underside of the first circuit board substrate.