US 12,279,374 B2
Circuit module and method for manufacturing submodule
Yoshihito Otsubo, Nagaokakyo (JP); and Minoru Hatase, Nagaokakyo (JP)
Assigned to Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed on Feb. 15, 2023, as Appl. No. 18/169,333.
Application 18/169,333 is a continuation of application No. PCT/JP2021/023191, filed on Jun. 18, 2021.
Claims priority of application No. 2020-146162 (JP), filed on Aug. 31, 2020.
Prior Publication US 2023/0199965 A1, Jun. 22, 2023
Int. Cl. H05K 1/02 (2006.01); H01L 23/538 (2006.01); H01L 23/552 (2006.01); H01L 25/18 (2023.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01)
CPC H05K 1/181 (2013.01) [H05K 1/023 (2013.01); H05K 3/284 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A circuit module comprising:
a main substrate;
a submodule mounted on a top surface of the main substrate;
a main sealing resin provided on the top surface of the main substrate, and covering at least part of the submodule; and
a conductive shield film covering at least part of the main sealing resin, wherein
the submodule includes:
a sub-substrate,
an electronic part mounted on a top surface of the sub-substrate;
a plurality of conductive members having linear shapes or bar shapes, and connected to the top surface of the sub-substrate and the shield film; and
a subsealing resin provided on the top surface of the sub-substrate, and covering at least part of the electronic part and part of each of the plurality of conductive members.