US 12,279,371 B2
Printed circuit board assembly and electronic device comprising same
Gyeongmin Jin, Suwon-si (KR); Jichul Kim, Suwon-si (KR); Yongjae Song, Suwon-si (KR); Jaeyeon Ra, Suwon-si (KR); and Chagyu Song, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Aug. 11, 2022, as Appl. No. 17/886,327.
Application 17/886,327 is a continuation of application No. PCT/KR2021/000450, filed on Jan. 13, 2021.
Claims priority of application No. 10-2020-0016129 (KR), filed on Feb. 11, 2020.
Prior Publication US 2022/0386465 A1, Dec. 1, 2022
Int. Cl. H05K 1/14 (2006.01); H05K 1/02 (2006.01)
CPC H05K 1/144 (2013.01) [H05K 1/0218 (2013.01); H05K 1/0298 (2013.01); H05K 2201/042 (2013.01); H05K 2201/10378 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A printed circuit board assembly comprising:
a first printed circuit board;
a second printed circuit board stacked with the first printed circuit board; and
an interposer arranged between the first printed circuit board and the second printed circuit board,
wherein the second printed circuit board comprises:
a first part; and
a second part extending from a part of the first part in a first direction and wherein a length of the second part in a second direction perpendicular to the first direction is less than a length of the first part in the second direction, and
wherein a first conductive pattern including a plurality of first conductors arranged in parallel is formed in the first part and a second conductive pattern including a plurality of second conductors arranged in parallel is formed in the second part, the plurality of first conductors extend in a direction that is substantially perpendicular to a direction in which the plurality of second conductors extend, and end portions of the plurality of second conductors are provided adjacent to one of the first conductors of the first conductive pattern, and
wherein the second printed circuit board comprises a plurality of layers including a ground layer and the first conductive pattern and the second conductive pattern are included in the ground layer.