US 12,279,370 B2
Hybrid through hole for solid state intrusion detection
Yong-Teng Lin, Yilan (TW); Bradford Edward Vier, Taipei (TW); Chun-Kai Tzeng, KeeLung (TW); Chin-Yao Hsu, Kaohsiung (TW); and Yu-Lin Tsai, New Taipei (TW)
Assigned to Dell Products L.P., Round Rock, TX (US)
Filed by DELL PRODUCTS L.P., Round Rock, TX (US)
Filed on Oct. 20, 2022, as Appl. No. 17/969,844.
Prior Publication US 2024/0135043 A1, Apr. 25, 2024
Prior Publication US 2024/0232444 A9, Jul. 11, 2024
Int. Cl. H05K 1/11 (2006.01); G06F 1/18 (2006.01); G06F 21/79 (2013.01); G08B 13/12 (2006.01); H05K 5/02 (2006.01)
CPC H05K 1/115 (2013.01) [G06F 1/183 (2013.01); G06F 21/79 (2013.01); G08B 13/128 (2013.01); H05K 5/0208 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An information handling system comprising:
a printed circuit board including a through hole via, the through hole via having top and bottom sections plated with a conductive plating material, and a middle section without any conductive plating material;
a screw to be placed in physical communication with the top, middle, and bottom sections of the through hole via in the printed circuit board; and
a processor to:
determine whether an electrical circuit is formed between the screw, the top section of the through hole via, and the bottom section of the through hole via; and
based on a determination of the electrical circuit being formed, provide a first indication that no intrusion has been made into the information handling system; and
a conductive sleeve to be inserted within the printed circuit board, wherein the conductive sleeve to provide electrical communication between the screw, the top section of the through hole via, and the bottom section of the through hole via, and to provide proper alignment of the screw within the through hole via.