US 12,279,367 B2
Wiring circuit board and producing method thereof
Rihito Fukushima, Osaka (JP); Hayato Takakura, Osaka (JP); and Naoki Shibata, Osaka (JP)
Assigned to NITTO DENKO CORPORATION, Osaka (JP)
Appl. No. 17/775,797
Filed by NITTO DENKO CORPORATION, Osaka (JP)
PCT Filed Oct. 13, 2020, PCT No. PCT/JP2020/038643
§ 371(c)(1), (2) Date May 10, 2022,
PCT Pub. No. WO2021/095421, PCT Pub. Date May 20, 2021.
Claims priority of application No. 2019-204942 (JP), filed on Nov. 12, 2019.
Prior Publication US 2022/0386459 A1, Dec. 1, 2022
Int. Cl. H05K 1/02 (2006.01); H05K 3/18 (2006.01); H05K 3/46 (2006.01)
CPC H05K 1/0298 (2013.01) [H05K 3/18 (2013.01); H05K 3/4644 (2013.01); H05K 2203/0703 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A wiring circuit board comprising:
a base insulating layer;
a first conductive layer disposed on one surface in a thickness direction of the base insulating layer;
an intermediate insulating layer disposed on one surface in the thickness direction of the base insulating layer so as to cover the first conductive layer;
a second conductive layer disposed on one surface in the thickness direction of the intermediate insulating layer,
wherein the first conductive layer includes:
a first wiring;
a first terminal, which is a single layer, and electrically connected to the first wiring; and
a second terminal, which is a single layer;
a connecting portion continuous with the second terminal; and
an auxiliary wiring continuous with the connecting portion, and
wherein the second conductive layer includes:
a second wiring electrically connected to the connecting portion of the first conductive layer in the thickness direction.