US 12,279,365 B2
Printed circuit board for transmitting signal in high-frequency band and electronic device comprising same
Eunseok Hong, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Sep. 30, 2022, as Appl. No. 17/957,870.
Application 17/957,870 is a continuation of application No. PCT/KR2021/003232, filed on Mar. 16, 2021.
Claims priority of application No. 10-2020-0039028 (KR), filed on Mar. 31, 2020; and application No. 10-2021-0025898 (KR), filed on Feb. 25, 2021.
Prior Publication US 2023/0035645 A1, Feb. 2, 2023
Int. Cl. H05K 1/02 (2006.01)
CPC H05K 1/0243 (2013.01) [H05K 1/0298 (2013.01); H05K 2201/09409 (2013.01); H05K 2201/09445 (2013.01); H05K 2201/10098 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device comprising a flexible circuit board comprising a signal line as a transmission line configured to transmit a signal in a frequency band,
wherein the flexible circuit board comprises:
a first conductive layer including at least one signal line to transmit the signal in the frequency band;
a second conductive layer including a pad connected to the at least one signal line in a pad region and disposed below the first conductive layer; and
a third conductive layer including a ground pad overlapping at least a part of the pad in the pad region and disposed above the first conductive layer.