	US 12,279,364 B2
	Printed circuit board with plurality of condctor patterns and vias
Jae Woong Choi, Suwon-si (KR); and Jae Ho Shin, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Feb. 6, 2023, as Appl. No. 18/106,129.
Claims priority of application No. 10-2022-0163065 (KR), filed on Nov. 29, 2022.
Prior Publication US 2024/0179830 A1, May 30, 2024
Int. Cl. H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/10 (2006.01); H05K 3/18 (2006.01)

CPC H05K 1/0224 (2013.01) [H05K 1/115 (2013.01); H05K 3/107 (2013.01); H05K 3/188 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/096 (2013.01)]

20 Claims

1. A printed circuit board, comprising:

a plurality of insulating layers each having a plurality of concave portions;

a plurality of conductor pattern layers disposed in the plurality of concave portions of each of the plurality of insulating layers;

first and second via holes connected to one of the plurality of concave portions independently of each other and penetrating through at least two of the plurality of insulating layers independently of each other; and

first and second via conductors disposed in the first and second via holes, respectively, and connecting two of the plurality of conductor pattern layers independently of each other,

wherein an average width of the first via conductor is greater than that of the second via conductor on a cross section.