US 12,279,363 B2
Electromagnetic wave absorber
Takashi Kawamura, Tokyo (JP)
Assigned to SONY GROUP CORPORATION, Tokyo (JP)
Appl. No. 18/248,586
Filed by SONY GROUP CORPORATION, Tokyo (JP)
PCT Filed Sep. 14, 2021, PCT No. PCT/JP2021/033617
§ 371(c)(1), (2) Date Apr. 11, 2023,
PCT Pub. No. WO2022/085337, PCT Pub. Date Apr. 28, 2022.
Claims priority of application No. 2020-176081 (JP), filed on Oct. 20, 2020.
Prior Publication US 2023/0397324 A1, Dec. 7, 2023
Int. Cl. H05K 1/02 (2006.01); H05K 1/16 (2006.01)
CPC H05K 1/0218 (2013.01) [H05K 1/162 (2013.01); H05K 2201/09263 (2013.01)] 12 Claims
OG exemplary drawing
 
1. An electromagnetic wave absorber, comprising:
a substrate;
a first wiring pattern mounted on one surface of the substrate; and
a second wiring pattern mounted on another surface opposite to the one surface,
wherein the first wiring pattern includes a line portion extending in parallel to a direction in which an external electric field is generated, a capacitor portion in which a potential difference is generated by the external electric field, and a first connecting portion and a second connecting portion which connect each of ends of the line portion with the capacitor portion, and
the second wiring pattern includes a wire portion which extends in a same direction as the line portion and is arranged at a position opposite to the line portion, and an extension portion that is branched to be bent from an end of the wire portion.