US 12,279,362 B2
Isolator
Yoshinari Tamura, Yokohama Kanagawa (JP); Yusuke Imaizumi, Kawasaki Kanagawa (JP); Jia Liu, Yokohama Kanagawa (JP); Daijo Chida, Yokohama Kanagawa (JP); and Minoru Takizawa, Sagamihara Kanagawa (JP)
Assigned to Kabushiki Kaisha Toshiba, Tokyo (JP); and Toshiba Electronic Devices & Storage Corporation, Tokyo (JP)
Filed by Kabushiki Kaisha Toshiba, Tokyo (JP); and Toshiba Electronic Devices & Storage Corporation, Tokyo (JP)
Filed on Feb. 23, 2023, as Appl. No. 18/173,767.
Claims priority of application No. 2022-144390 (JP), filed on Sep. 12, 2022.
Prior Publication US 2024/0090120 A1, Mar. 14, 2024
Int. Cl. H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/0216 (2013.01) [H05K 1/111 (2013.01); H05K 1/115 (2013.01); H05K 1/165 (2013.01); H05K 1/181 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An isolator comprising:
a first semiconductor chip;
a second semiconductor chip;
a first wiring board including a first surface facing in a first direction, the first surface being provided thereon with the first semiconductor chip;
a second wiring board including a second surface facing in the first direction, the second surface being provided thereon with the second semiconductor chip, the second wiring board being spaced apart from the first wiring board in a second direction intersecting the first direction;
a third wiring board spaced apart from each of the first wiring board and the second wiring board in the first direction;
a first coil provided on the first surface of the first wiring board and electrically coupled to the first semiconductor chip;
a second coil provided on the second surface of the second wiring board and electrically coupled to the second semiconductor chip;
a third coil provided on a third surface of the third wiring board, the third surface facing the first surface of the first wiring board and the second surface of the second wiring board, the third coil facing the first coil;
a fourth coil provided on the third surface of the third wiring board, facing the second coil, and electrically coupled to the third coil; and
an insulator provided between the first coil and the second coil, between the first coil and the third coil, between the second coil and the fourth coil, and between the third coil and the fourth coil.