US 12,279,045 B2
Vehicular camera module
Jianguo Wang, Troy, MI (US); Garret Achenbach, Rochester Hills, MI (US); Ove Salomonsson, Farmington Hills, MI (US); Tom H Toma, Waterford, MI (US); Edward R. Ahlquist, Jr., Troy, MI (US); Brian J. Winden, Rochester, MI (US); and Christopher L. Van Dan Elzen, Rochester, MI (US)
Assigned to Magna Electronics Inc., Auburn Hills, MI (US)
Filed by Magna Electronics Inc., Auburn Hills, MI (US)
Filed on May 24, 2024, as Appl. No. 18/673,422.
Application 18/673,422 is a continuation of application No. 18/464,354, filed on Sep. 11, 2023, granted, now 11,997,392.
Application 18/464,354 is a continuation of application No. 17/646,006, filed on Dec. 27, 2021, granted, now 11,758,274, issued on Sep. 12, 2023.
Application 17/646,006 is a continuation of application No. 16/948,176, filed on Sep. 7, 2020, granted, now 11,212,453, issued on Dec. 28, 2021.
Application 16/948,176 is a continuation of application No. 16/665,062, filed on Oct. 28, 2019, granted, now 10,771,708, issued on Sep. 8, 2020.
Application 16/665,062 is a continuation of application No. 16/396,856, filed on Apr. 29, 2019, granted, now 10,462,375, issued on Oct. 29, 2019.
Application 16/396,856 is a continuation of application No. 16/042,042, filed on Jul. 23, 2018, granted, now 10,277,825, issued on Apr. 30, 2019.
Application 16/042,042 is a continuation of application No. 15/871,173, filed on Jan. 15, 2018, granted, now 10,033,934, issued on Jul. 24, 2018.
Application 15/871,173 is a continuation of application No. 14/377,939, granted, now 9,596,387, issued on Mar. 14, 2017, previously published as PCT/US2013/026101, filed on Feb. 14, 2013.
Application 14/377,939 is a continuation in part of application No. 14/233,507, granted, now 9,871,971, issued on Jan. 16, 2018, previously published as PCT/US2012/048993, filed on Jul. 31, 2012.
Claims priority of provisional application 61/600,205, filed on Feb. 17, 2012.
Claims priority of provisional application 61/583,431, filed on Jan. 5, 2012.
Claims priority of provisional application 61/514,191, filed on Aug. 2, 2011.
Prior Publication US 2024/0314443 A1, Sep. 19, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H04N 23/70 (2023.01); B60R 11/04 (2006.01); H04N 7/18 (2006.01); H04N 23/51 (2023.01); H04N 23/55 (2023.01); H04N 23/57 (2023.01); B60R 11/00 (2006.01)
CPC H04N 23/70 (2023.01) [B60R 11/04 (2013.01); H04N 7/18 (2013.01); H04N 7/183 (2013.01); H04N 23/55 (2023.01); B60R 2011/0026 (2013.01); H04N 23/51 (2023.01); H04N 23/57 (2023.01)] 121 Claims
OG exemplary drawing
 
1. A vehicular camera module, said vehicular camera module comprising:
a main circuit board electrically connected with an imager circuit board;
a lens barrel accommodating at least one lens;
a lens holder, wherein the lens holder comprises a passageway;
wherein the lens barrel is at least partially disposed in the passageway of the lens holder;
an imager disposed at said imager circuit board;
wherein the imager disposed at said imager circuit board comprises a photosensor array having at least one million photosensor elements arranged in rows and columns;
a housing comprising an upper cover and a lower cover;
wherein said housing is configured for mounting at a mounting bracket disposed at an in-cabin side of a windshield of a vehicle equipped with said vehicular camera module;
wherein the upper cover and the lower cover are joined together;
wherein said main circuit board comprises a printed circuit board (main PCB) having a first planar side and an opposing second planar side separated from the first planar side by a thickness dimension of the main PCB of said main circuit board;
wherein said imager circuit board comprises a printed circuit board (imager PCB) having a first planar side and an opposing second planar side separated from the first planar side by a thickness dimension of the imager PCB of said imager circuit board;
wherein electronic circuitry is disposed at the main PCB of said main circuit board;
wherein the electronic circuitry disposed at the main PCB of said main circuit board comprises an image processor;
wherein said image processor comprises an image processing chip;
wherein said image processor is operable to process image data captured by the imager;
wherein the main PCB of said main circuit board comprises a multilayered printed circuit board;
wherein the electronic circuitry disposed at the main PCB of said main circuit board comprises an electrical connector configured for electrical connection to a connector of a vehicular wire harness;
wherein, with the imager operated to capture image data, image data captured by the imager is provided via a flexible ribbon cable to the electronic circuitry disposed at the main PCB of said main circuit board;
wherein said housing, with the upper cover and the lower cover joined together, comprises a front portion and a rear portion;
wherein said front portion is in front of said rear portion;
wherein the imager is disposed within said rear portion of said housing and is not accommodated within said front portion of said housing;
wherein said housing of said vehicular camera module has breadth and length;
wherein the main PCB of said main circuit board extends across the breadth of said housing and along the length of said housing;
wherein a maximum rear height dimension of said rear portion of said housing is greater than a maximum front height dimension of said front portion of said housing, and wherein the maximum rear height dimension of said rear portion of said housing is 35 mm or less; and
wherein a stray light shield is disposed at the mounting bracket that is disposed at the in-cabin side of the windshield of the equipped vehicle.