| CPC H04N 23/57 (2023.01) [H04N 23/51 (2023.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01)] | 11 Claims |
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1. An image sensor module, comprising:
an image sensor which has a rectangular shape having a long side and a short side;
a substrate which has a long side corresponding to the long side of the image sensor, and a short side corresponding to the short side of the image sensor, wherein the image sensor is mounted on the substrate;
a sub-housing installed on the substrate, the sub-housing having a first sidewall disposed on a side corresponding to the long side of the image sensor, and a second sidewall disposed on a side corresponding to the short side of the image sensor; and
an adhesive, which bonds the sub-housing and the substrate,
wherein a side surface of the substrate, disposed on the long side of the substrate, and an outer surface of the adhesive are disposed on a same plane,
wherein the substrate comprises an image sensor mounting portion disposed to protrude from a surface of the substrate, and
wherein the adhesive is disposed to be spaced apart from the image sensor mounting portion.
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