US 12,278,614 B2
Multilayer piezoelectric substrate with reduced side leakage and transverse mode suppression
Rei Goto, Osaka (JP); Gong Bin Tang, Moriguchi (JP); Keiichi Maki, Suita (JP); and Hironori Fukuhara, Ibaraki (JP)
Assigned to SKYWORKS SOLUTIONS, INC., Irvine, CA (US)
Filed by SKYWORKS SOLUTIONS, INC., Irvine, CA (US)
Filed on Jul. 15, 2022, as Appl. No. 17/812,761.
Claims priority of provisional application 63/222,559, filed on Jul. 16, 2021.
Prior Publication US 2023/0013597 A1, Jan. 19, 2023
Int. Cl. H03H 9/02 (2006.01); H03H 3/08 (2006.01); H03H 9/145 (2006.01); H03H 9/25 (2006.01); H03H 9/64 (2006.01)
CPC H03H 9/02866 (2013.01) [H03H 3/08 (2013.01); H03H 9/02574 (2013.01); H03H 9/02992 (2013.01); H03H 9/145 (2013.01); H03H 9/25 (2013.01); H03H 9/6483 (2013.01); H03H 9/6489 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An acoustic wave device, comprising:
a multilayer piezoelectric substrate, the multilayer piezoelectric substrate including a layer of piezoelectric material having a lower surface disposed on an upper surface of a layer of a dielectric material, the dielectric material having a lower surface disposed on an upper surface of a carrier substrate;
an interdigital transducer disposed on the multilayer piezoelectric substrate, the interdigital transducer including an active region configured to generate an acoustic wave; and
first and second high impedance portions included within the multilayer piezoelectric substrate, the first and second high impedance portions each positioned outside the active region of the interdigital transducer and extending in a direction of propagation of the acoustic wave to be generated by the interdigital transducer, the first and second high impedance portions included within the layer of dielectric material and/or the layer of piezoelectric material.