US 12,278,608 B2
Method for manufacturing a substrate for a radiofrequency device
Djamel Belhachemi, Saint Martin d'Heres (FR); and Thierry Barge, Bernin (FR)
Assigned to SOITEC, Bernin (FR)
Filed by Soitec, Bernin (FR)
Filed on Jan. 4, 2024, as Appl. No. 18/404,685.
Application 18/404,685 is a continuation of application No. 17/041,367, granted, now 11,870,411, previously published as PCT/FR2019/050685, filed on Mar. 26, 2019.
Claims priority of application No. 1852574 (FR), filed on Mar. 26, 2018.
Prior Publication US 2024/0146275 A1, May 2, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H03H 3/10 (2006.01); C09J 7/30 (2018.01); H03H 9/02 (2006.01); H03H 9/25 (2006.01); H03H 9/64 (2006.01); H10N 30/073 (2023.01); H10N 30/08 (2023.01); H10N 30/082 (2023.01); H10N 30/086 (2023.01)
CPC H03H 3/10 (2013.01) [C09J 7/30 (2018.01); H03H 9/02574 (2013.01); H03H 9/02834 (2013.01); H03H 9/02897 (2013.01); H03H 9/25 (2013.01); H03H 9/6489 (2013.01); H10N 30/073 (2023.02); H10N 30/08 (2023.02); H10N 30/082 (2023.02); H10N 30/086 (2023.02)] 20 Claims
OG exemplary drawing
 
1. A process for fabricating a substrate for a radiofrequency device, comprising:
providing a piezoelectric substrate;
depositing a dielectric layer on a surface of the piezoelectric substrate;
providing a carrier substrate;
assembling together the piezoelectric substrate and the carrier substrate with a polymerizable adhesive directly between the dielectric layer and the carrier substrate to form an assembled substrate; and
polymerizing the polymerizable adhesive layer to form a polymerized layer bonding the piezoelectric substrate to the carrier substrate, the polymerized layer and the dielectric layer together forming an electrically insulating layer between the piezoelectric substrate and the carrier substrate.