US 12,278,498 B2
Device housing for wirelessly receiving power, and device having the same
Yuji Tanabe, Tokyo (JP); and Naoto Kodate, Tokyo (JP)
Assigned to Aeterlink Corp., Tokyo (JP)
Appl. No. 18/038,241
Filed by Aeterlink Corp., Tokyo (JP)
PCT Filed Mar. 31, 2021, PCT No. PCT/JP2021/014102
§ 371(c)(1), (2) Date May 23, 2023,
PCT Pub. No. WO2022/113396, PCT Pub. Date Jun. 2, 2022.
Claims priority of application No. 2020-194699 (JP), filed on Nov. 24, 2020.
Prior Publication US 2024/0097489 A1, Mar. 21, 2024
Int. Cl. H02J 50/00 (2016.01); H02J 50/20 (2016.01); H02J 50/80 (2016.01)
CPC H02J 50/005 (2020.01) [H02J 50/20 (2016.02); H02J 50/80 (2016.02)] 13 Claims
OG exemplary drawing
 
1. A device housing constituting a main body of a device which is a sensor or an actuator,
wherein the device housing is provided with a power-receiving device for mainly generating an electric field or a magnetic field for performing wireless power supply;
wherein the power-receiving device includes at least one of a dipole antenna, a slot antenna, a monopole antenna, a chip antenna and an inverted-F antenna; and
wherein the device housing has a size in a three-dimensional space, and expansion of the size of the device housing in the three-dimensional space due to the provision of the power receiving devices is substantially limited to one axis direction at most.