| CPC H01R 13/005 (2013.01) [B60L 53/16 (2019.02); B60L 53/302 (2019.02); H01R 4/183 (2013.01)] | 14 Claims |

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1. A contact arrangement comprising:
at least one device for producing an electrically conductive connection; and
at least one cooling device for configured to cool heat dissipation of the heat generated from the transmission of electric power by the conductive connection, the at least one cooling device comprising a line cooling region and a connection cooling region that surrounds the line cooling region,
wherein the electrically conductive device has at least one connecting region for coupling to at least one cooling-chamber delimitation and at least one contact region,
wherein the coupling of the at least one cooling-chamber delimitation and at least one contact region takes place directly in an integrative manner so that the cooling effect is facilitated as a result of the at least partly direct physical contact between the electrically conductive device and the cooling medium, and
wherein a fluid coupling of the cooling region and the line cooling region takes place through at least one opening in the connecting element so that a cooling-medium volume flow between the line cooling region and the surrounding connection cooling region is facilitated.
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