US 12,278,441 B2
Ultra-dense, low-profile edge card connector
Marc Epitaux, Gland (CH); Eric J. Zbinden, Santa Clara, CA (US); John Coronati, Colorado Springs, CO (US); Jignesh H. Shah, Santa Clara, CA (US); and Brandon Thomas Gore, Lexington, SC (US)
Assigned to SAMTEC, INC., New Albany, IN (US)
Appl. No. 17/273,364
Filed by SAMTEC, INC., New Albany, IN (US)
PCT Filed Sep. 4, 2019, PCT No. PCT/US2019/049458
§ 371(c)(1), (2) Date Mar. 4, 2021,
PCT Pub. No. WO2020/051183, PCT Pub. Date Mar. 12, 2020.
Claims priority of provisional application 62/726,833, filed on Sep. 4, 2018.
Claims priority of provisional application 62/727,227, filed on Sep. 5, 2018.
Claims priority of provisional application 62/812,492, filed on Mar. 1, 2019.
Prior Publication US 2021/0194164 A1, Jun. 24, 2021
Int. Cl. H01R 12/73 (2011.01); G02B 6/42 (2006.01); H01L 23/498 (2006.01); H01L 25/18 (2023.01); H01R 12/62 (2011.01); H01R 12/72 (2011.01); H01R 13/506 (2006.01); H01R 13/631 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01)
CPC H01R 12/732 (2013.01) [G02B 6/4246 (2013.01); G02B 6/4269 (2013.01); H01L 23/49838 (2013.01); H01R 13/506 (2013.01); H01R 13/631 (2013.01); H05K 1/117 (2013.01); H05K 1/18 (2013.01); H01L 25/18 (2013.01); H01R 12/62 (2013.01); H01R 12/725 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10189 (2013.01)] 17 Claims
OG exemplary drawing
 
1. An interconnect system comprising:
an IC package including an IC package substrate and an IC die mounted on the IC package substrate;
a compliant circuit that extends from the IC package substrate and is in electrical communication with the IC package substrate;
an extension card that extends from the compliant circuit and is in electrical communication with the compliant circuit, and thus also with the IC package;
an electrical path that is established between the extension card and the IC die without traveling first through a host substrate when the IC package is mounted to the host substrate; and
an electrical connector permanently mounted to the extension card.