US 12,278,439 B2
Shared ground mmWave and sub 6 GHz antenna system
Wei Huang, San Diego, CA (US); Ping Shi, San Diego, CA (US); and Xiaoyin He, San Diego, CA (US)
Assigned to HUAWEI TECHNOLOGIES CO., LTD., Shenzhen (CN)
Appl. No. 17/311,484
Filed by Huawei Technologies Co., Ltd., Shenzhen (CN)
PCT Filed Apr. 28, 2019, PCT No. PCT/CN2019/084826
§ 371(c)(1), (2) Date Jun. 7, 2021,
PCT Pub. No. WO2020/119010, PCT Pub. Date Jun. 18, 2020.
Claims priority of provisional application 62/777,555, filed on Dec. 10, 2018.
Prior Publication US 2022/0029298 A1, Jan. 27, 2022
Int. Cl. H01Q 9/42 (2006.01); H01Q 1/22 (2006.01); H01Q 1/24 (2006.01); H01Q 5/35 (2015.01); H01Q 5/40 (2015.01); H01Q 9/04 (2006.01); H01Q 21/28 (2006.01)
CPC H01Q 9/42 (2013.01) [H01Q 1/2283 (2013.01); H01Q 1/243 (2013.01); H01Q 5/35 (2015.01); H01Q 5/40 (2015.01); H01Q 9/0407 (2013.01); H01Q 21/28 (2013.01)] 25 Claims
OG exemplary drawing
 
1. An antenna system in an electronic device, the antenna system comprising:
a first antenna configured to operate at a first frequency band, wherein the first antenna comprises a plurality of openings; and
a second antenna configured to operate at a second frequency band, wherein a feeding network of the second antenna is embedded within a transmission line medium of a signal return path of the first antenna such that the transmission line medium comprises the feeding network of the second antenna,
wherein the second antenna comprises an array of antenna elements, at least one antenna element of the array of antenna elements is inside one of the plurality of openings of the first antenna and configured to radiate through the one of the plurality of openings of the first antenna,
wherein the electronic device comprises a first printed circuit board (PCB) comprising a processor and a modem, and wherein the second antenna further comprises:
a flex circuit;
a circuit clip (c-clip);
a second PCB electrically coupled to the first PCB using the c-clip or a flex circuit board electrically coupled to the first PCB using the c-clip; and
an integrated circuit (IC) mounted on the second PCB or on the flex circuit board, the IC configured to electrically couple to the array of antenna elements of the second antenna using the flex circuit.