US 12,278,420 B2
Electronic device including mmWave antenna module
Younghoon Kim, Gyeonggi-do (KR); Juhyun Park, Gyeonggi-do (KR); Younggirl Yun, Gyeonggi-do (KR); Taewook Ham, Gyeonggi-do (KR); Haejin Lee, Gyeonggi-do (KR); and Jooho Jang, Gyeonggi-do (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed on Feb. 5, 2021, as Appl. No. 17/168,321.
Claims priority of application No. 10-2020-0015267 (KR), filed on Feb. 7, 2020.
Prior Publication US 2021/0249760 A1, Aug. 12, 2021
Int. Cl. H01Q 1/38 (2006.01); H01Q 1/02 (2006.01); H01Q 1/24 (2006.01); H01Q 1/52 (2006.01); H04B 1/00 (2006.01)
CPC H01Q 1/243 (2013.01) [H01Q 1/02 (2013.01); H01Q 1/526 (2013.01); H04B 1/0057 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a window forming at least a portion of a front surface of the electronic device;
a cover forming at least a portion of a rear surface of the electronic device;
a bracket disposed between the window and the cover;
a printed circuit board supported by the bracket and disposed between the window and the cover;
a shield can disposed on the printed circuit board covering a designated area of the printed circuit board;
at least one communication processor disposed on the printed circuit board; and
a mmWave antenna module connected to the printed circuit board, and electrically connected with the at least one communication processor via the printed circuit board,
wherein the mm Wave antenna module is disposed on a first area of the shield can, the first area of the shield can separate from a second area of the shield can by a step, such that the first area is above the second area, the mm Wave antenna module configured to transfer heat to the shield can, and
wherein the mmWave antenna module is directly exposed to the cover, and includes a connector disposed between the cover and the second area of the shield can.