US 12,278,318 B2
Component and method for producing a component
Thomas Schwarz, Regensburg (DE)
Assigned to OSRAM Opto Semiconductors GmbH, Regensburg (DE)
Appl. No. 17/626,082
Filed by OSRAM Opto Semiconductors GmbH, Regensburg (DE)
PCT Filed Jun. 19, 2020, PCT No. PCT/EP2020/067159
§ 371(c)(1), (2) Date Jan. 10, 2022,
PCT Pub. No. WO2021/008813, PCT Pub. Date Jan. 21, 2021.
Claims priority of application No. 10 2019 119 371.0 (DE), filed on Jul. 17, 2019.
Prior Publication US 2022/0376152 A1, Nov. 24, 2022
Int. Cl. H01L 33/62 (2010.01); H01L 23/00 (2006.01); H01L 25/075 (2006.01); H01L 33/54 (2010.01)
CPC H01L 33/62 (2013.01) [H01L 24/24 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 25/0753 (2013.01); H01L 33/54 (2013.01); H01L 2224/24051 (2013.01); H01L 2224/24247 (2013.01); H01L 2224/32013 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92244 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0066 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A device having a component, a lead frame and a molded body, wherein
the component and the lead frame are at least locally enclosed in lateral directions by the molded body, the lead frame not protruding beyond side faces of the molded body,
the lead frame has at least one first subregion including a mounting face being configured with structured corners so that the device in plan view laterally protrudes beyond the mounting face at the structured corners, and at least one second subregion laterally separated from the first subregion, the component being electrically conductively connected by means of a planar contact structure to the second subregion, and
the component is arranged on the first subregion in plan view and laterally protrudes at least locally beyond the first subregion, so that the component and the first subregion form an anchoring structure on which the molded body is anchored with the component and the first subregion.