a carrier board having a board body, a plurality of through holes and a plurality of conductive portions, wherein the board body is defined with a first surface and a second surface opposite to each other, the plurality of the through holes communicate the first surface and the second surface of the board body, each of the plurality of the through holes is defined with a first opening and a second opening opposite to each other, the plurality of the conductive portions are arranged on the first surface of the board body, and the first opening of each of the plurality of the through holes is sealed by corresponding one of the plurality of the conductive portions; and

a laminated structure comprising a viscid layer and a plurality of conductive elements, wherein the viscid layer is defined with two surfaces, one of the surfaces of the viscid layer is in surface contact with the second surface of the board body, each of the plurality of the conductive elements passes through and accommodates in the viscid layer, and corresponds to one of the plurality of the through holes of the carrier board in a projection direction of the carrier board, and one end of each of the plurality of the conductive elements is electrically connected to one of the plurality of the conductive portions through the corresponding through hole,

wherein the board body is a resilient board, a rigid board or a composite board.