US 12,278,287 B2
Selective internal gate structure for ferroelectric semiconductor devices
Cheng-Ming Lin, Kaohsiung (TW); Sai-Hooi Yeong, Zhubei (TW); Ziwei Fang, Hsinchu (TW); Chi On Chui, Hsinchu (TW); and Huang-Lin Chao, Hillsboro, OR (US)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Feb. 27, 2023, as Appl. No. 18/175,346.
Application 18/175,346 is a continuation of application No. 17/328,145, filed on May 24, 2021, granted, now 11,594,633.
Application 17/328,145 is a continuation of application No. 16/549,245, filed on Aug. 23, 2019, granted, now 11,018,256, issued on May 25, 2021.
Prior Publication US 2023/0207695 A1, Jun. 29, 2023
Int. Cl. H01L 29/78 (2006.01); H01L 21/02 (2006.01); H01L 21/28 (2006.01); H01L 29/51 (2006.01); H01L 29/66 (2006.01)
CPC H01L 29/78391 (2014.09) [H01L 21/02068 (2013.01); H01L 29/40111 (2019.08); H01L 29/516 (2013.01); H01L 29/66795 (2013.01); H01L 29/6684 (2013.01); H01L 29/7851 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device, comprising:
first and second spacers on a substrate;
a high-k capacitor between the first and second spacers, wherein the high-k capacitor comprises:
a high-k dielectric layer on the substrate and sidewalls of the first and second spacers; and
an internal gate on the high-k dielectric layer; and
a ferroelectric capacitor on the high-k capacitor, wherein the ferroelectric capacitor comprises:
a ferroelectric dielectric layer on the internal gate, wherein a side surface of the ferroelectric dielectric layer comprises a convex portion and a concave portion, and wherein an interface between the internal gate and the ferroelectric dielectric layer is in contact with a boundary between a side surface of the internal gate and the convex portion of the side surface of the ferroelectric dielectric layer; and
an electrode on the ferroelectric dielectric layer.