US 12,278,265 B2
Method for fabricating a fin with minimal length between two single-diffusion break (SDB) trenches
Chien-Heng Liu, Pingtung County (TW); Chia-Wei Huang, Kaohsiung (TW); Hsin-Jen Yu, Tainan (TW); Yung-Feng Cheng, Kaohsiung (TW); and Ming-Jui Chen, Hsinchu (TW)
Assigned to UNITED MICROELECTRONICS CORP., Hsin-Chu (TW)
Filed by UNITED MICROELECTRONICS CORP., Hsin-Chu (TW)
Filed on Jun. 7, 2023, as Appl. No. 18/206,617.
Application 18/206,617 is a division of application No. 17/118,630, filed on Dec. 11, 2020, granted, now 11,715,759.
Claims priority of application No. 202011276918.0 (CN), filed on Nov. 16, 2020.
Prior Publication US 2023/0317778 A1, Oct. 5, 2023
Int. Cl. H01L 29/66 (2006.01); H01L 21/762 (2006.01); H01L 29/06 (2006.01); H01L 29/78 (2006.01)
CPC H01L 29/0649 (2013.01) [H01L 21/76224 (2013.01); H01L 29/66795 (2013.01); H01L 29/785 (2013.01); H01L 29/7851 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A method for fabricating minimal fin length, comprising:
forming a fin-shaped structure extending along a first direction on a substrate;
forming a first single-diffusion break (SDB) trench and a second SDB trench extending along a second direction to divide the fin-shaped structure into a first portion, a second portion, and a third portion; and
performing a fin-cut process to remove the first portion and the third portion.